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DELL  PE2850
SM110507
중고상품
CPU 2 * DC 3.0GHz / 800MHZ
Memory 4 * 1GB (PC2-3200R , 6Slot)
HDD 2 * 73GB (SCSI, 6Slot)
Raid Perc 4E/DI
재고 5 EA (실제수량은 다를수 있으니 문의바랍니다.)
   
수량 :  
Processor  
Processor type
Up to two Intel? Xeon™ processors with a minimum clock speed of at least 2.8 GHz
Front-side bus speed
800 MHz
L2 cache
at least 1MB internal cache
Expansion Bus 
Bus type
PCI-X, PCI Express
Expansion slots via riser card cage:
 
PCI-X
one 3.3-V, 64-bit, 100-MHz or three 3.3-V, 64 bit, 133MHz
PCI Express
one x4 lane width
one x8 lane width
Memory 
Architecture
144-bit ECC registered PC2-3200 DDR2 SDRAM DIMMs, with two-way interleaving, rated for 400-MHz operation
Memory module sockets
Six 240-pin
Memory module capacities
256 MB, 512 MB, 1 GB, 2 GB, or 4 GB (when available)
Minimum RAM
256 MB (one 256-MB module)
Maximum RAM
16 GB
Drives 
SCSI hard drives
up to six 1-inch, internal, hot-plug, Ultra320 SCSI
Diskette drive
one optional 3.5-inch, 1.44-MB
external optional USB 3.5-inch, 1.44-MB
Optical drive
one optional IDE CD or DVD
external optional USB CD
Flash drive
external optional USB
Connectors 
Externally accessible
Back
NIC
Two RJ-45 (for integrated 1-Gigabit NICs)
PS/2-style keyboard
6-pin mini-DIN
PS/2-compatible mouse
6-pin mini-DIN
Serial
9-pin, DTE, 16550-compatible
USB
Two 4-pin, USB 2.0 compliant
Video
15-pin VGA
Front
Video
15-pin VGA
USB
Two 4-pin, USB 2.0 compliant
Internally accessible
SCSI channels
Two 68-pin U320 SCSI
Video 
Video type
ATI Radeon 7000-M video controller; VGA connectors
Video memory
16 MB
Power 
AC power supply (per power supply)
Wattage
700W
Voltage
84 -264 VAC, autoranging, 47-63 Hz, 10.1 A
Heat dissipation
2388 BTU/hr maximum
Maximum inrush current
Under typical line conditions and over the entire system ambient operating range, the inrush current may reach 25 A per power supply for 10 ms or less.
Batteries
 
System battery
CR 2032 3.0-V lithium ion coin cell
ROMB battery (optional)
4.1-V lithium ion
Physical 
Height
8.656 cm (3.40 in)
Width
44.7 cm (17.6 in)
Depth
75.68 cm (29.79in)
Weight (maximum configuration)
26.76 kg (59 lb)
Environmental 
NOTE: For additional information about environmental measurements for specific system configurations, see www.dell.com/environmental_datasheets.
Temperature
Operating
10° to 35°C (50° to 95°F)
Storage
–40° to 65°C (–40° to 149°F)
Relative humidity
Operating
8% to 85% (noncondensing) with a maximum humidity gradation of 10% per hour
Storage
5% to 95% (noncondensing)
Maximum vibration
Operating
0.25 G at 3–200 Hz for 15 min
Storage
0.5 G at 3–200 Hz for 15 min
Maximum shock
Operating
One shock pulse in the positive z axis (one pulse on each side of the system) of 41 G for up to 2 ms
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms
Altitude
Operating
–16 to 3048 m (–50 to 10,000 ft)
Storage
–16 to 10,600 m (–50 to 35,000 ft)
Processor  
Processor type
Up to two Intel? Xeon™ processors with a minimum clock speed of at least 2.8 GHz
Front-side bus speed
800 MHz
L2 cache
at least 1MB internal cache
Expansion Bus 
Bus type
PCI-X, PCI Express
Expansion slots via riser card cage:
 
PCI-X
one 3.3-V, 64-bit, 100-MHz or three 3.3-V, 64 bit, 133MHz
PCI Express
one x4 lane width
one x8 lane width
Memory 
Architecture
144-bit ECC registered PC2-3200 DDR2 SDRAM DIMMs, with two-way interleaving, rated for 400-MHz operation
Memory module sockets
Six 240-pin
Memory module capacities
256 MB, 512 MB, 1 GB, 2 GB, or 4 GB (when available)
Minimum RAM
256 MB (one 256-MB module)
Maximum RAM
16 GB
Drives 
SCSI hard drives
up to six 1-inch, internal, hot-plug, Ultra320 SCSI
Diskette drive
one optional 3.5-inch, 1.44-MB
external optional USB 3.5-inch, 1.44-MB
Optical drive
one optional IDE CD or DVD
external optional USB CD
Flash drive
external optional USB
Connectors 
Externally accessible
Back
NIC
Two RJ-45 (for integrated 1-Gigabit NICs)
PS/2-style keyboard
6-pin mini-DIN
PS/2-compatible mouse
6-pin mini-DIN
Serial
9-pin, DTE, 16550-compatible
USB
Two 4-pin, USB 2.0 compliant
Video
15-pin VGA
Front
Video
15-pin VGA
USB
Two 4-pin, USB 2.0 compliant
Internally accessible
SCSI channels
Two 68-pin U320 SCSI
Video 
Video type
ATI Radeon 7000-M video controller; VGA connectors
Video memory
16 MB
Power 
AC power supply (per power supply)
Wattage
700W
Voltage
84 -264 VAC, autoranging, 47-63 Hz, 10.1 A
Heat dissipation
2388 BTU/hr maximum
Maximum inrush current
Under typical line conditions and over the entire system ambient operating range, the inrush current may reach 25 A per power supply for 10 ms or less.
Batteries
 
System battery
CR 2032 3.0-V lithium ion coin cell
ROMB battery (optional)
4.1-V lithium ion
Physical 
Height
8.656 cm (3.40 in)
Width
44.7 cm (17.6 in)
Depth
75.68 cm (29.79in)
Weight (maximum configuration)
26.76 kg (59 lb)
Environmental 
NOTE: For additional information about environmental measurements for specific system configurations, see www.dell.com/environmental_datasheets.
Temperature
Operating
10° to 35°C (50° to 95°F)
Storage
–40° to 65°C (–40° to 149°F)
Relative humidity
Operating
8% to 85% (noncondensing) with a maximum humidity gradation of 10% per hour
Storage
5% to 95% (noncondensing)
Maximum vibration
Operating
0.25 G at 3–200 Hz for 15 min
Storage
0.5 G at 3–200 Hz for 15 min
Maximum shock
Operating
One shock pulse in the positive z axis (one pulse on each side of the system) of 41 G for up to 2 ms
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms
Altitude
Operating
–16 to 3048 m (–50 to 10,000 ft)
Storage
–16 to 10,600 m (–50 to 35,000 ft)
Processor  
Processor type
Up to two Intel? Xeon™ processors with a minimum clock speed of at least 2.8 GHz
Front-side bus speed
800 MHz
L2 cache
at least 1MB internal cache
Expansion Bus 
Bus type
PCI-X, PCI Express
Expansion slots via riser card cage:
 
PCI-X
one 3.3-V, 64-bit, 100-MHz or three 3.3-V, 64 bit, 133MHz
PCI Express
one x4 lane width
one x8 lane width
Memory 
Architecture
144-bit ECC registered PC2-3200 DDR2 SDRAM DIMMs, with two-way interleaving, rated for 400-MHz operation
Memory module sockets
Six 240-pin
Memory module capacities
256 MB, 512 MB, 1 GB, 2 GB, or 4 GB (when available)
Minimum RAM
256 MB (one 256-MB module)
Maximum RAM
16 GB
Drives 
SCSI hard drives
up to six 1-inch, internal, hot-plug, Ultra320 SCSI
Diskette drive
one optional 3.5-inch, 1.44-MB
external optional USB 3.5-inch, 1.44-MB
Optical drive
one optional IDE CD or DVD
external optional USB CD
Flash drive
external optional USB
Connectors 
Externally accessible
Back
NIC
Two RJ-45 (for integrated 1-Gigabit NICs)
PS/2-style keyboard
6-pin mini-DIN
PS/2-compatible mouse
6-pin mini-DIN
Serial
9-pin, DTE, 16550-compatible
USB
Two 4-pin, USB 2.0 compliant
Video
15-pin VGA
Front
Video
15-pin VGA
USB
Two 4-pin, USB 2.0 compliant
Internally accessible
SCSI channels
Two 68-pin U320 SCSI
Video 
Video type
ATI Radeon 7000-M video controller; VGA connectors
Video memory
16 MB
Power 
AC power supply (per power supply)
Wattage
700W
Voltage
84 -264 VAC, autoranging, 47-63 Hz, 10.1 A
Heat dissipation
2388 BTU/hr maximum
Maximum inrush current
Under typical line conditions and over the entire system ambient operating range, the inrush current may reach 25 A per power supply for 10 ms or less.
Batteries
 
System battery
CR 2032 3.0-V lithium ion coin cell
ROMB battery (optional)
4.1-V lithium ion
Physical 
Height
8.656 cm (3.40 in)
Width
44.7 cm (17.6 in)
Depth
75.68 cm (29.79in)
Weight (maximum configuration)
26.76 kg (59 lb)
Environmental 
NOTE: For additional information about environmental measurements for specific system configurations, see www.dell.com/environmental_datasheets.
Temperature
Operating
10° to 35°C (50° to 95°F)
Storage
–40° to 65°C (–40° to 149°F)
Relative humidity
Operating
8% to 85% (noncondensing) with a maximum humidity gradation of 10% per hour
Storage
5% to 95% (noncondensing)
Maximum vibration
Operating
0.25 G at 3–200 Hz for 15 min
Storage
0.5 G at 3–200 Hz for 15 min
Maximum shock
Operating
One shock pulse in the positive z axis (one pulse on each side of the system) of 41 G for up to 2 ms
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms
Altitude
Operating
–16 to 3048 m (–50 to 10,000 ft)
Storage
–16 to 10,600 m (–50 to 35,000 ft)
Processor  
Processor type
Up to two Intel? Xeon™ processors with a minimum clock speed of at least 2.8 GHz
Front-side bus speed
800 MHz
L2 cache
at least 1MB internal cache
Expansion Bus 
Bus type
PCI-X, PCI Express
Expansion slots via riser card cage:
 
PCI-X
one 3.3-V, 64-bit, 100-MHz or three 3.3-V, 64 bit, 133MHz
PCI Express
one x4 lane width
one x8 lane width
Memory 
Architecture
144-bit ECC registered PC2-3200 DDR2 SDRAM DIMMs, with two-way interleaving, rated for 400-MHz operation
Memory module sockets
Six 240-pin
Memory module capacities
256 MB, 512 MB, 1 GB, 2 GB, or 4 GB (when available)
Minimum RAM
256 MB (one 256-MB module)
Maximum RAM
16 GB
Drives 
SCSI hard drives
up to six 1-inch, internal, hot-plug, Ultra320 SCSI
Diskette drive
one optional 3.5-inch, 1.44-MB
external optional USB 3.5-inch, 1.44-MB
Optical drive
one optional IDE CD or DVD
external optional USB CD
Flash drive
external optional USB
Connectors 
Externally accessible
Back
NIC
Two RJ-45 (for integrated 1-Gigabit NICs)
PS/2-style keyboard
6-pin mini-DIN
PS/2-compatible mouse
6-pin mini-DIN
Serial
9-pin, DTE, 16550-compatible
USB
Two 4-pin, USB 2.0 compliant
Video
15-pin VGA
Front
Video
15-pin VGA
USB
Two 4-pin, USB 2.0 compliant
Internally accessible
SCSI channels
Two 68-pin U320 SCSI
Video 
Video type
ATI Radeon 7000-M video controller; VGA connectors
Video memory
16 MB
Power 
AC power supply (per power supply)
Wattage
700W
Voltage
84 -264 VAC, autoranging, 47-63 Hz, 10.1 A
Heat dissipation
2388 BTU/hr maximum
Maximum inrush current
Under typical line conditions and over the entire system ambient operating range, the inrush current may reach 25 A per power supply for 10 ms or less.
Batteries
 
System battery
CR 2032 3.0-V lithium ion coin cell
ROMB battery (optional)
4.1-V lithium ion
Physical 
Height
8.656 cm (3.40 in)
Width
44.7 cm (17.6 in)
Depth
75.68 cm (29.79in)
Weight (maximum configuration)
26.76 kg (59 lb)
Environmental 
NOTE: For additional information about environmental measurements for specific system configurations, see www.dell.com/environmental_datasheets.
Temperature
Operating
10° to 35°C (50° to 95°F)
Storage
–40° to 65°C (–40° to 149°F)
Relative humidity
Operating
8% to 85% (noncondensing) with a maximum humidity gradation of 10% per hour
Storage
5% to 95% (noncondensing)
Maximum vibration
Operating
0.25 G at 3–200 Hz for 15 min
Storage
0.5 G at 3–200 Hz for 15 min
Maximum shock
Operating
One shock pulse in the positive z axis (one pulse on each side of the system) of 41 G for up to 2 ms
Storage
Six consecutively executed shock pulses in the positive and negative x, y, and z axes (one pulse on each side of the system) of 71 G for up to 2 ms
Altitude
Operating
–16 to 3048 m (–50 to 10,000 ft)
Storage
–16 to 10,600 m (–50 to 35,000 ft)
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Processor  
Processor type Up to two Intel? Xeon™ processors with a minimum clock speed of at least 2.8 GHz
Front-side bus speed 800 MHz
L2 cache at least 1MB internal cache
　
Expansion Bus 
Bus type PCI-X, PCI Express